Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7052968 | Method and system for aligning IC die to package substrate | Ajit M. Dubey | 2006-05-30 |
| 7030772 | Inspection for alignment between IC die and package substrate | Ajit M. Dubey, Leang Hua Kam, Loo Kean Teoh | 2006-04-18 |