| 9869713 |
Through-silicon via (TSV) crack sensors for detecting TSV cracks in three-dimensional (3D) integrated circuits (ICs) (3DICs), and related methods and systems |
Ratibor Radojcic, Yang Du |
2018-01-16 |
| 9741691 |
Power delivery network (PDN) design for monolithic three-dimensional (3-D) integrated circuit (IC) |
Kambiz Samadi, Yang Du |
2017-08-22 |
| 9626311 |
Memory controller placement in a three-dimensional (3D) integrated circuit (IC) (3DIC) employing distributed through-silicon-via (TSV) farms |
Karamvir CHATHA, Yang Du, Kambiz Samadi |
2017-04-18 |
| 9508615 |
Clock tree synthesis for low cost pre-bond testing of 3D integrated circuits |
Kambiz Samadi, Pratyush Kamal, Yang Du |
2016-11-29 |
| 9483598 |
Intellectual property block design with folded blocks and duplicated pins for 3D integrated circuits |
Kambiz Samadi, Yang Du |
2016-11-01 |
| 9256246 |
Clock skew compensation with adaptive body biasing in three-dimensional (3D) integrated circuits (ICs) (3DICs) |
Yang Du |
2016-02-09 |