| 9470635 |
System of measuring warpage and method of measuring warpage |
Seung Wan Woo, Young-Nam Hwang, Po Chul Kim, Kyung Ho Lee |
2016-10-18 |
| 9279861 |
Apparatus for testing switching of power semiconductor module |
Shang Hoon Seo, Seung Hwan Kim |
2016-03-08 |
| 9263187 |
Multilayer ceramic electronic component and method of manufacturing the same |
Kwang Jik Lee, Ji-hyuk Lim |
2016-02-16 |
| 9192050 |
Method of manufacturing printed circuit board |
Sung Yeol Park, Jung Tae Park, Seung Heon Han, Jung Eun Noh |
2015-11-17 |
| 9189105 |
Touch sensor |
Hee Jin Park, Ji-hyuk Lim, Seung Mi Lee |
2015-11-17 |
| 9164145 |
Apparatus and method for testing semiconductor device |
Shang Hoon Seo, Seung Hwan Kim |
2015-10-20 |
| 9155192 |
Electronic component package |
Kyung Ho Lee, Seung Wan Woo, Po Chul Kim, Young-Nam Hwang |
2015-10-06 |
| 9099329 |
In nanowire, device using the same and method of manufacturing in nanowire |
Hee Suk Chung, Gyu Seok Kim, Han Wool Kang, Kyung Ho Lee, Mi Yang Kim |
2015-08-04 |
| 9095063 |
Printed circuit board and method of manufacturing the same |
Eun Ju Yang, Gyu Seok Kim, Se Yoon Park, Jin Uk Cha, Hee Suk Chung +1 more |
2015-07-28 |
| 9065071 |
Organic light emitting device with a protective layer including at least one of a nano-clay and a graphite oxide formed on the anode |
Kwang Jik Lee, Ji-hyuk Lim |
2015-06-23 |
| 9045646 |
Insulating composition for substrate, and prepreg and substrate using the same |
Soo-Young Ji, Seung Hwan Kim |
2015-06-02 |
| 9030432 |
Touch panel and producing method for via electrode |
Sung Yeol Park, Jung Eun Noh |
2015-05-12 |
| 8974901 |
Multilayer thin film for ceramic electronic component and method of manufacturing the same |
Kwang Jik Lee, Ji-hyuk Lim |
2015-03-10 |
| 8940186 |
Insulating layer composition for substrate, and prepreg and substrate using the same |
Soo-Young Ji, Seung Hwan Kim, Do-Young Kim |
2015-01-27 |
| 8755167 |
Ceramic sheet product for ceramic electronic component, multilayer ceramic electronic component using the same and method of manufacturing multilayer ceramic electronic component |
Kwang Jik Lee, Ji-hyuk Lim |
2014-06-17 |
| 8013349 |
Light emitting device and method of manufacturing the same |
Seung-tae Choi, Hyun-Soo Kim, Jin-seung Choi, Ki Hwan Kwon, Chang-youl Moon |
2011-09-06 |
| 7906841 |
Wafer level incapsulation chip and encapsulation chip manufacturing method |
Byung-gil Jeong, In-sang Song, Woon-bae Kim, Min-seog Choi, Ji-hyuk Lim |
2011-03-15 |
| 7755151 |
Wafer level package for surface acoustic wave device and fabrication method thereof |
Ji-hyuk Lim, Jun Sik Hwang, Woon-bae Kim, Jong-oh Kwon, Moon-chul Lee +1 more |
2010-07-13 |
| 7449366 |
Wafer level packaging cap and fabrication method thereof |
Moon-chul Lee, Jong-oh Kwon, Woon-bae Kim, Ji-hyuk Lim, Jun Sik Hwang +1 more |
2008-11-11 |
| 7408257 |
Packaging chip and packaging method thereof |
Kyu-dong Jung, Woon-bae Kim, In-sang Song, Moon-chul Lee, Jun Sik Hwang |
2008-08-05 |
| 7374972 |
Micro-package, multi-stack micro-package, and manufacturing method therefor |
Jong-oh Kwon, Woon-bae Kim, In-sang Song, Ji-hyuk Lim, Byung-gil Jeong |
2008-05-20 |
| 7285865 |
Micro-package, multi-stack micro-package, and manufacturing method therefor |
Jong-oh Kwon, Woon-bae Kim, In-sang Song, Ji-hyuk Lim, Byung-gil Jeong |
2007-10-23 |
