Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5758413 | Method of manufacturing a multiple layer circuit board die carrier with fine dimension stacked vias | Ku Ho Chong, Charles H. Crockett, Jr., Karl G. Hoebener, Michael G. McMaster | 1998-06-02 |
| 5699613 | Fine dimension stacked vias for a multiple layer circuit board structure | Ku Ho Chong, Charles H. Crockett, Jr., Karl G. Hoebener, Michael G. McMaster | 1997-12-23 |
| 5615387 | Method and apparatus for reworking printed circuit boards using surface coating and selective removal of an electrically conductive material | Charles H. Crockett, Jr., Steven A. Duncan, David W. Malone, Michael G. McMaster | 1997-03-25 |