Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9953964 | Method for manufacturing semiconductor package | Hongbin Shi, Junho Lee | 2018-04-24 |
| 9748160 | Semiconductor package, method of fabricating the same, and semiconductor module | — | 2017-08-29 |