HS

Hongbin Shi

Samsung: 5 patents #22,466 of 75,807Top 30%
Huawei: 3 patents #4,041 of 15,535Top 30%
ZT Zte: 1 patents #1,433 of 3,593Top 40%
Overall (All Time): #539,443 of 4,157,543Top 15%
9
Patents All Time

Issued Patents All Time

Showing 1–9 of 9 patents

Patent #TitleCo-InventorsDate
12369249 Printed circuit board assembly and electronic device Xin Guo, Lixiang Wang, Haisheng Tu, Benyin Zheng 2025-07-22
11367700 Electronic package, terminal and method for processing electronic package Zhuqiu Wang, Runqing Ye, Haohui Long 2022-06-21
11011477 High-reliability electronic packaging structure, circuit board, and device Runqing Ye, Haohui Long 2021-05-18
10050020 Stack-type semiconductor package Junho Lee 2018-08-14
9985008 Method of fabricating a semiconductor package Junho Lee 2018-05-29
9953964 Method for manufacturing semiconductor package Soonbum Kim, Junho Lee 2018-04-24
9786644 Methods of fabricating a semiconductor package Hojeong Moon, Kang Joon LEE 2017-10-10
9728516 Electric apparatus including electric patterns for suppressing solder bridges Kang Joon LEE 2017-08-08
9590798 Synchronization system, method and master/slave optical module device for detecting asymmetry of optical fibers Li He 2017-03-07