Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6767477 | Etching process to selectively remove copper plating seed layer | Xue Hua Wu, Wensen Li, Henry Chang, Kochan Ju, Jei-Wei Chang | 2004-07-27 |
| 6428719 | Etching process to selectively remove copper plating seed layer | Xuehua Wu, Wensen Li, Henry Chang, Kochan Ju, Jei-Wei Chang | 2002-08-06 |