Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6767477 | Etching process to selectively remove copper plating seed layer | Wensen Li, Si-Tuan Lam, Henry Chang, Kochan Ju, Jei-Wei Chang | 2004-07-27 |
| 6627390 | Masking frame plating method for forming masking frame plated layer | Yi-Chun Liu, Yining Hu, Jei-Wei Chang, Kochan Ju | 2003-09-30 |