SH

Siping Hu

YC Yangtze Memory Technologies Co.: 11 patents #78 of 626Top 15%
WC Wuhan Xinxin Semiconductor Manufacturing Co.: 1 patents #31 of 78Top 40%
Overall (All Time): #338,555 of 4,157,543Top 9%
14
Patents All Time

Issued Patents All Time

Showing 1–14 of 14 patents

Patent #TitleCo-InventorsDate
12136599 Three-dimensional memory devices and fabricating methods thereof He Chen, Shu Wu, Zhen Pan, Yi Zhao, Ziqun Hua 2024-11-05
12133386 Contact pads of three-dimensional memory device and fabrication method thereof Yongqing Wang 2024-10-29
12089406 Three-dimensional memory device comprising contact pads exposed by an opening passing through layer stack and fabrication method thereof Yongqing Wang 2024-09-10
12080697 Method for forming a three-dimensional (3D) memory device having bonded semiconductor structures Shiqi Huang, Wei Liu, Bater Chelon 2024-09-03
11978719 Metal-dielectric bonding method and structure 2024-05-07
11842911 Wafer stress control using backside film deposition and laser anneal Pengan Yin, Shu Wu, Lina Miao 2023-12-12
11798913 Metal-dielectric bonding method and structure 2023-10-24
11495569 Metal-dielectric bonding method and structure 2022-11-08
11450653 Bonded three-dimensional memory devices having bonding layers Shiqi Huang, Wei Liu, Bater Chelon 2022-09-20
11233041 Bonded three-dimensional memory devices and methods for forming the same Shiqi Huang, Wei Liu, Bater Chelon 2022-01-25
11037945 Bonded three-dimensional memory devices and methods for forming the same Shiqi Huang, Wei Liu, Bater Chelon 2021-06-15
11013807 Stable fat-soluble active ingredient composition, microcapsule and process of preparation and use thereof Guoquan Mao, Hongming Zhu, Wenxin Ma, Zhiping Liang, Li Qian +5 more 2021-05-25
9455297 Preparation process of image sensors Jifeng Zhu, Sheng'an Xiao, Jinwen Dong 2016-09-27
8697919 1-methoxyl-2, 6, 10-trimethyl-1, 3, 5, 9-undec-tetraene, and preparation method and uses thereof Xuejun Lao, Runpu Shen, Weidong Ye, Xiaohua Song, Luo Liu +2 more 2014-04-15