Issued Patents All Time
Showing 1–25 of 161 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431410 | Semiconductor device with polymer liner and method for fabricating the same | — | 2025-09-30 |
| 12381167 | Semiconductor structure having vias with different dimensions | Chih-Ching Lin | 2025-08-05 |
| 12354965 | Semiconductor device with redistribution structure and method for fabricating the same | — | 2025-07-08 |
| 12347730 | Method of manufacturing semiconductor structure having vias with different dimensions | Chih-Ching Lin | 2025-07-01 |
| 12315774 | Semiconductor structure having heat dissipation structure | — | 2025-05-27 |
| 12315796 | Method for preparing semiconductor device with composite passivation structure | — | 2025-05-27 |
| 12278190 | Manufacturing method of semiconductor package structure having interconnections between dies | — | 2025-04-15 |
| 12272651 | Semiconductor package structure having interconnections between dies and manufacturing method thereof | — | 2025-04-08 |
| 12272620 | Semiconductor structure having elastic member within via | — | 2025-04-08 |
| 12266564 | Semiconductor device | Chiang-Lin Shih | 2025-04-01 |
| 12205912 | Semiconductor package structure and method for preparing the same | — | 2025-01-21 |
| 12198977 | Manufacturing method of semiconductor structure having elastic member within via | — | 2025-01-14 |
| 12191258 | Semiconductor device having integral alignment marks with decoupling features and method for fabricating the same | — | 2025-01-07 |
| 12142596 | Semiconductor structure and manufacturing method thereof | — | 2024-11-12 |
| 12100634 | Semiconductor device with re-fill layer | — | 2024-09-24 |
| 11935831 | Semiconductor device with connecting structure and method for fabricating the same | — | 2024-03-19 |
| 11935816 | Conductive feature with non-uniform critical dimension and method of manufacturing the same | Jheng-Ting Jhong | 2024-03-19 |
| 11901344 | Manufacturing method of semiconductor package | — | 2024-02-13 |
| 11901334 | Microelectronic devices including embedded bridge interconnect structures | — | 2024-02-13 |
| 11876063 | Semiconductor package structure and method for preparing the same | — | 2024-01-16 |
| 11876079 | Method for fabricating semiconductor device with recessed pad layer | — | 2024-01-16 |
| 11798879 | Semiconductor device with composite passivation structure and method for preparing the same | — | 2023-10-24 |
| 11765882 | Method for fabricating semiconductor device | — | 2023-09-19 |
| 11742242 | Method for manufacturing through-silicon via with liner | Sheng-Fu Huang | 2023-08-29 |
| 11735499 | Semiconductor device with protection layers and method for fabricating the same | Tse-Yao Huang | 2023-08-22 |