Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6777250 | Manufacture of wafer level semiconductor device with quality markings on the sealing resin | Yoshiyuki Yoneda, Hideharu Sakoda | 2004-08-17 |
| 6600217 | Mounting substrate and mounting method for semiconductor device | Masanori Onodera, Masamitsu Ikumo | 2003-07-29 |
| 6420213 | Method for fixing a semiconductor device having stud bumps to a substrate by an electrically non-conductive adhesive | Masanori Onodera, Masamitsu Ikumo | 2002-07-16 |