Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7456452 | Light sensor having undulating features for CMOS imager | David H. Wells | 2008-11-25 |
| 7163893 | Advanced barrier liner formation for vias | — | 2007-01-16 |
| 6833623 | Enhanced barrier liner formation for via | — | 2004-12-21 |
| 6828233 | Enhanced barrier liner formation for vias | — | 2004-12-07 |
| 6800180 | Resputtering to achieve better step coverage | — | 2004-10-05 |
| 6690094 | High aspect ratio metallization structures | Randle D. Burton | 2004-02-10 |
| 6660136 | Method of forming a non-volatile resistance variable device and method of forming a metal layer comprising silver and tungsten | Jiutao Li | 2003-12-09 |
| 6495921 | High aspect ratio metallization structures | Randle D. Burton | 2002-12-17 |
| 6346177 | Method of in-situ cleaning and deposition of device structures in a high density plasma environment | — | 2002-02-12 |
| 6323124 | Resputtering to achieve better step coverage | — | 2001-11-27 |
| 6258718 | Method for reducing surface charge on semiconductor wafers to prevent arcing during plasma deposition | Randle D. Burton | 2001-07-10 |
| 6224942 | Method of forming an aluminum comprising line having a titanium nitride comprising layer thereon | — | 2001-05-01 |
| 6187151 | Method of in-situ cleaning and deposition of device structures in a high density plasma environment | — | 2001-02-13 |
| 6121134 | High aspect ratio metallization structures and processes for fabricating the same | Randle D. Burton | 2000-09-19 |
| 6090246 | Methods and apparatus for detecting reflected neutrals in a sputtering process | — | 2000-07-18 |
| 6057235 | Method for reducing surface charge on semiconducter wafers to prevent arcing during plasma deposition | Randle D. Burton | 2000-05-02 |
| 5997699 | Insitu faceting during deposition | — | 1999-12-07 |
| 5985102 | Kit for electrically isolating collimator of PVD chamber, chamber so modified, and method of using | — | 1999-11-16 |
| 5928480 | Methods of sputter depositing of metals onto substrates, and methods of forming plasma | — | 1999-07-27 |
| 5882488 | Resputtering to achieve better step coverage | — | 1999-03-16 |
| 5783282 | Resputtering to achieve better step coverage of contact holes | — | 1998-07-21 |
| 5705042 | Electrically isolated collimator and method | Richard L. Elliot | 1998-01-06 |
| 5667645 | Method of sputter deposition | — | 1997-09-16 |