Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8421213 | Package structure | Zhao-Chong Zeng, Zhi-Hui Yang | 2013-04-16 |
| 8188379 | Package substrate structure | — | 2012-05-29 |
| 8129829 | Package substrate having embedded photosensitive semiconductor chip and fabrication method thereof | Kan-Jung Chia | 2012-03-06 |
| 7973397 | Package substrate having embedded semiconductor chip and fabrication method thereof | Kan-Jung Chia | 2011-07-05 |
| 7908744 | Method for fabricating printed circuit board having capacitance components | Chih-Kui Yang | 2011-03-22 |