Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12416763 | Fiber attach enabled wafer level fanout | Michael Davenport, Roy Meade | 2025-09-16 |
| 11867944 | Photonic systems to enable top-side wafer-level optical and electrical test | Roy Meade, Chen Sun, John Fini, Forrest Sedgwick | 2024-01-09 |
| 11822128 | Fiber attach enabled wafer level fanout | Michael Davenport, Roy Meade | 2023-11-21 |
| 11323181 | Phase optimization technique in high-speed simultaneous bidirectional links | — | 2022-05-03 |
| 11280959 | Photonics systems to enable top-side wafer-level optical and electrical test | Roy Meade, Chen Sun, John Fini, Forrest Sedgwick | 2022-03-22 |
| 11163120 | Fiber attach enabled wafer level fanout | Michael Davenport, Roy Meade | 2021-11-02 |
| 10361786 | Phase optimization technique in high-speed simultaneous bi-directional links | — | 2019-07-23 |