Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10734258 | Underfill solution supplying device for a dispenser, dispenser including the same, and method of manufacturing a semiconductor module using the same | Young-rock Lee, Han-Ju Kim, Hun HAN | 2020-08-04 |
| 9922846 | Method of manufacturing semiconductor package | Young-rock Lee, Chang-kun Kang, Chil-hoon Lee, Han-Ju Kim | 2018-03-20 |
| 9056377 | Router apparatus | Chan-Hyung Yun, Hyun-Jong Oh, Hun HAN | 2015-06-16 |
| 8616907 | Test socket for testing electrical characteristics of a memory module | Jung-Hoon Kim, Yong Hyun Kim, Kwang-Su Yu, Jae-Seon Hwang | 2013-12-31 |
| 8587946 | Semiconductor module socket apparatus | Joo Han Lee, Jung-Hoon Kim | 2013-11-19 |
| 8385080 | Semiconductor module, socket for the same, and semiconductor module/socket assembly | Jung-Hoon Kim, Dong-Chun Lee, Jae Hoon Choi, Sun-kyu Hwang | 2013-02-26 |
| 8218330 | Reworkable passive element embedded printed circuit board | Hyo-Jae Bang, Dong-Chun Lee, Jun-Young Lee, Jung-Hyeon Kim | 2012-07-10 |
| 8189342 | Printed circuit board for memory module, method of manufacturing the same and memory module/socket assembly | Hyo-Jae Bang, Dong-Chun Lee, Ho-Geon Song, Kwang-Su Yu, Dong-Woo Shin | 2012-05-29 |
| 8148828 | Semiconductor packaging device | Dong-Woo Shin, Sun-kyu Hwang, Hyun-Jong Oh, Nam-Yong Oh | 2012-04-03 |
| 8070048 | Method of attaching a solder ball and method of repairing a memory module | Nam-Yong Oh, Jae Young Kim, Jae Hoon Choi | 2011-12-06 |
| 8053889 | Semiconductor module | Dong-Woo Shin, Hyun-Jong Oh, Nam-Yong Oh | 2011-11-08 |
| 7960655 | Printed circuit board, method of manufacturing the printed circuit board, memory module having the printed circuit board and method of manufacturing the memory module | Dong-Chun Lee, Young-Soo Lee | 2011-06-14 |
| 7906423 | Semiconductor device and method of manufacturing the same | Hyo-Jae Bang, Heui-Seog Kim, Dong-Chun Lee, Jung-Hyeon Kim | 2011-03-15 |
| 7902664 | Semiconductor package having passive component and semiconductor memory module including the same | Hyo-Jae Bang, Dong-Chun Lee, Kyung-Du Kim, Sun-kyu Hwang | 2011-03-08 |
| 7900349 | Method of fabricating an electronic device | Dong-Woo Shin, Young-Soo Lee, Hyo-Jae Bang, Hun Han | 2011-03-08 |
| 7791178 | Lead frame unit, semiconductor package having a lead frame unit, stacked semiconductor package having a semiconductor package and methods of manufacturing the same | Hyo-Jae Bang, Heui-Seog Kim, Jung-Hyeon Kim, Sung Hwan Kim | 2010-09-07 |
| 7663219 | Semiconductor device and method of manufacturing the same | Hyo-Jae Bang, Heui-Seog Kim, Dong-Chun Lee, Jung-Hyeon Kim | 2010-02-16 |
| 7576437 | Printed circuit board of semiconductor package and method for mounting semiconductor package using the same | Dong-Chun Lee, Kwang-Su Yu, Dong-Woo Shin, Hyo-Jae Bang, Hyun-Seok Choi +1 more | 2009-08-18 |
| 6449156 | Heat sink provided with coupling means, memory module attached with the heat sink and manufacturing method thereof | Dong-Woo Shin, Dong-Chun Lee, Wang Lee | 2002-09-10 |
| 6062799 | Apparatus and method for automatically loading or unloading printed circuit boards for semiconductor modules | Dong-Chun Lee, Kwang-Su Yu, O Kyung Kwon | 2000-05-16 |
| 5927504 | Apparatus for carrying plural printed circuit boards for semiconductor module | Dong-Chun Lee, Kwang-Su Yu, O Kyung Kwon | 1999-07-27 |