Issued Patents All Time
Showing 1–25 of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12025692 | Sensing device | Young Ki Lee, Joon Seok Chae, Tae Gyu RYU | 2024-07-02 |
| 10992033 | Antenna apparatus | Hong-seok Lee, Bo Hyun Seo, Sung-Youl Choi, Young Ki Lee, Tae Gyu RYU | 2021-04-27 |
| 9318352 | Power module package and method for manufacturing the same | Kwang Soo Kim, Young Ki Lee, Jin Suk Son | 2016-04-19 |
| 9257615 | Light emitting device package and method of manufacturing the same | Young Ki Lee, Hyung Jin Jeon, Sang Hyun Shin | 2016-02-09 |
| 9231167 | Insulation structure for high temperature conditions and manufacturing method thereof | Young Ki Lee, Sang Hyun Shin | 2016-01-05 |
| 9107313 | Method of manufacturing a hybrid heat-radiating substrate | Chang Hyun Lim, Jung Eun Kang, Heung-Soo Park, Kwang Soo Kim, Joon Seok Chae +1 more | 2015-08-11 |
| 8941220 | Power module package and system module having the same | Kwang Soo Kim, Young Ki Lee, Sung Keun Park | 2015-01-27 |
| 8842438 | 3D power module package | Tae Hoon Kim, Jae-Cheon Doh | 2014-09-23 |
| 8823153 | Semiconductor package | Tae Hoon Kim | 2014-09-02 |
| 8800137 | Method of manufacturing printed circuit board | Jin Su Kim | 2014-08-12 |
| 8736077 | Semiconductor package substrate | Jong-Man Kim, Young Hoon Kwak, Kyu Hwan Oh, Tae Hoon Kim | 2014-05-27 |
| 8729683 | Power module package and method for fabricating the same | Kwang Soo Kim, Ji Hyun Park, Young Ki Lee | 2014-05-20 |
| 8686295 | Heat-dissipating substrate and fabricating method thereof | Chang Hyun Lim, Sang Hyun Shin, Young Ki Lee, Sung Keun Park | 2014-04-01 |
| 8664755 | Power module package and method for manufacturing the same | Chang Hyun Lim, Young Ki Lee, Kwang Soo Kim | 2014-03-04 |
| 8630090 | Heat dissipation device for power conversion module | Young Ho Sohn, Kyu Bum Han, Young Jin Cho | 2014-01-14 |
| 8630097 | Power module using sintering die attach and manufacturing method thereof | Tae Hyun Kim, Yong Hui JOO | 2014-01-14 |
| 8610146 | Light emitting diode package and method of manufacturing the same | Sang Hyun Shin, Young Ki Lee | 2013-12-17 |
| 8603842 | Method of manufacturing package substrate for optical element | Chang Hyun Lim, Sang Hyun Shin, Sung Keun Park, Young Ki Lee | 2013-12-10 |
| 8586128 | Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereof | Sang Hyun Shin, Young Ki Lee | 2013-11-19 |
| 8553417 | Heat-radiating substrate and method of manufacturing the same | Ji Hyun Park, Young Ki Lee | 2013-10-08 |
| 8502374 | Power module package and method for manufacturing the same | Kwang Soo Kim, Young Ki Lee, Sung Keun Park, Chang Hyun Lim | 2013-08-06 |
| 8493167 | Transformer having the heat radiation function | Jong-Man Kim, Kyu Bum Han | 2013-07-23 |
| 8476090 | Method forming a semiconductor light emitting device with perforations formed within | Sang Hyun Shin, Young Ki Lee | 2013-07-02 |
| 8315056 | Heat-radiating substrate and method of manufacturing the same | Chang Hyun Lim, Jung Eun Kang, Kwang Soo Kim, Sung Keun Park | 2012-11-20 |
| 8309399 | Power semiconductor module and method of manufacturing the same | Shan Gao, Tae Hyun Kim, Ju Pyo Hong, Bum Sik Jang, Ji Hyun Park | 2012-11-13 |