SW

Sari Wacks

IBM: 1 patents #44,794 of 70,183Top 65%
Overall (All Time): #3,788,419 of 4,157,543Top 95%
1
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
5277749 Methods and apparatus for relieving stress and resisting stencil delamination when performing lift-off processes that utilize high stress metals and/or multiple evaporation steps Jonathan H. Griffith, John I. Kim, Thomas L. Leong, William J. Tilly 1994-01-11