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Nanoporous composite separators with increased thermal conductivity |
David W. Avison, Shreyans Shingi, Chandrakant C. Patel, Charles R. Comeau, JR. |
2022-07-12 |
| 11217859 |
Nanoporous composite separators with increased thermal conductivity |
David W. Avison, Shreyans Shingi, Chandrakant C. Patel, Charles R. Comeau, JR. |
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Nanoporous composite separators with increased thermal conductivity |
David W. Avison, Shreyans Shingi, Chandrakant C. Patel, Charles R. Comeau, JR. |
2020-12-29 |
| 9735298 |
Backing sheet for photovoltaic modules |
Marina Temchenko, David W. Avison, Frank A. Mannarino, Shogo Sugiura |
2017-08-15 |
| 8676681 |
Methods and apparatus for using assignable fee profiles to define fee structures for remittance services |
David Chan, Rama Sridhar |
2014-03-18 |
| 8507029 |
Backing sheet for photovoltaic modules |
Marina Temchenko, David W. Avison, Frank A. Mannarino |
2013-08-13 |
| 8473385 |
Format in computer-provided user interface for entering transaction fee structure |
David Chan, Rama Sridhar |
2013-06-25 |
| 8422126 |
Crystalline infrared reflective films |
Steven A. Carlson, David W. Avison, Ifenna Kingsley Anakor, Greg Robert Farrell, Richard J. D'Amato |
2013-04-16 |
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Unequal hierarchical communications modulation method |
Charles C. Wang, Lan Xu |
2010-12-21 |
| 7151388 |
Method for testing semiconductor devices and an apparatus therefor |
Ballson Gopal, Ching Teong |
2006-12-19 |
| 7065321 |
Method and apparatus of using satellites to augment traffic capacity of a wireless network infrastructure |
— |
2006-06-20 |
| 7026958 |
Method and system of utilizing satellites to transmit traffic congestion information to vehicles |
S. Lynne Wainfan, Richard T. Riley |
2006-04-11 |
| 5705933 |
Resuable carrier for burn-in/testing on non packaged die |
Siew K. Tan |
1998-01-06 |
| 5572140 |
Reusable carrier for burn-in/testing on non packaged die |
Siew K. Tan |
1996-11-05 |
| 5543725 |
Reusable carrier for burn-in/testing on non packaged die |
Siew K. Tan |
1996-08-06 |
| 5530376 |
Reusable carrier for burn-in/testing of non packaged die |
Siew K. Tan |
1996-06-25 |
| 5528466 |
Assembly for mounting and cooling a plurality of integrated circuit chips using elastomeric connectors and a lid |
Siew K. Tan |
1996-06-18 |
