Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9991400 | Collector sheet for solar cell and solar cell module employing same | Takayuki Komai | 2018-06-05 |
| 9666746 | Conductive base for forming wiring pattern of collector sheet for solar cells, and method for producing collector sheet for solar cells | Takayuki Komai | 2017-05-30 |
| 9293607 | Collector sheet for solar cell and solar cell module employing same | Takayuki Komai | 2016-03-22 |
| 9053262 | Method of determining reinforcement position of circuit substrate and substrate assembly | Hiroshi Kobayashi, Toru Okada, Masayuki Kitajima, Takumi Masuyama | 2015-06-09 |
| 8604347 | Board reinforcing structure, board assembly, and electronic device | Hiroshi Kobayashi, Masayuki Kitajima, Toru Okada | 2013-12-10 |
| 8434670 | Repair apparatus and repair method | Toru Okada | 2013-05-07 |
| 8314339 | Circuit board with kneaded conductive paste | Masayuki Kitajima, Takeshi Ishitsuka | 2012-11-20 |
| 6787925 | Mounting method of semiconductor device | Kazuhisa Tsunoi, Hidehiko Kira, Shunji Baba, Akira Fujii, Toshihiro Kusagaya +3 more | 2004-09-07 |
| 6458237 | Mounting method of semiconductor device | Kazuhisa Tsunoi, Hidehiko Kira, Shunji Baba, Akira Fujii, Toshihiro Kusagaya +3 more | 2002-10-01 |
| 6240634 | Method of producing a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board | Hidehiko Kira, Kenji Kobae, Norio Kainuma, Naoki Ishikawa | 2001-06-05 |
| 6122823 | Apparatus to produce a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board | Hidehiko Kira, Kenji Kobae, Norio Kainuma, Naoki Ishikawa | 2000-09-26 |
| 6006426 | Method of producing a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board | Hidehiko Kira, Kenji Kobae, Norio Kainuma, Naoki Ishikawa | 1999-12-28 |