Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087697 | Semiconductor devices with recessed pads for die stack interconnections | Andrew M. Bayless, Brandon P. Wirz | 2024-09-10 |
| 11715696 | Semiconductor devices with recessed pads for die stack interconnections | Andrew M. Bayless, Brandon P. Wirz | 2023-08-01 |