Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8969170 | Method of forming a semiconductor structure including a metal-insulator-metal capacitor | Maik Liebau | 2015-03-03 |
| 8778795 | Metallization systems of semiconductor devices comprising a copper/silicon compound as a barrier material | Jens Heinrich | 2014-07-15 |
| 8685807 | Method of forming metal gates and metal contacts in a common fill process | Ralf Richter, Jens Heinrich | 2014-04-01 |
| 8673770 | Methods of forming conductive structures in dielectric layers on an integrated circuit device | Torsten Huisinga, Jens Heinrich | 2014-03-18 |
| 8383510 | Semiconductor device comprising metallization layers of reduced interlayer capacitance by reducing the amount of etch stop materials | Jens Heinrich, Torsten Huisinga, Ralf Richter | 2013-02-26 |