Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10658211 | Data structures for semiconductor die packaging | Joseph Anthony Boduch, Sandia You Ni Chiu, Michael F. Pas | 2020-05-19 |
| 10068786 | Data structures for semiconductor die packaging | Joseph Anthony Boduch, Sandia You Ni Chiu, Michael F. Pas | 2018-09-04 |