Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10750617 | Bond-free interconnect between a microcircuit housing and a printed circuit assembly | Michael John Harriman, Ryan Michael Avella, Leonard M. Weber, Brian R. Hutchison, Naveed Edalati +2 more | 2020-08-18 |