Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8791492 | Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same | Jin Han Ju, Jerry Deleon | 2014-07-29 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8791492 | Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same | Jin Han Ju, Jerry Deleon | 2014-07-29 |