Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9018074 | Photonic semiconductor devices in LLC assembly with controlled molding boundary and method for forming same | Xianzhu Zhang, Arthur John Barlow | 2015-04-28 |
| 8791492 | Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same | Jin Han Ju, Robert Burman | 2014-07-29 |
| 8431951 | Optoelectronic devices with laminate leadless carrier packaging in side-looker or top-looker device orientation | Xianzhu Zhang, Arthur John Barlow, Juergen Schliz | 2013-04-30 |