Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10553475 | Single layer integrated circuit package | Zalina Binti Abdullah, Poh Cheng Ang, Poh Choon Whong, Hai San Tew, Shin Hung Hwang +2 more | 2020-02-04 |
| 10049935 | Integrated circuit package having pin up interconnect | Zalina Binti Abdullah, Poh Cheng Ang, Poh Choon Whong, Hai San Tew, Shin Hung Hwang +2 more | 2018-08-14 |