Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10553475 | Single layer integrated circuit package | Zalina Binti Abdullah, Roslan Bin Ahmad, Poh Cheng Ang, Poh Choon Whong, Shin Hung Hwang +2 more | 2020-02-04 |
| 10461004 | Integrated circuit substrate and method of producing thereof | Zalina Binti Abdullah, Roslan Bin Ahmad, Poh Cheng Ang, Poh Choon Whong, Shin Hung Hwang +2 more | 2019-10-29 |
| 10049935 | Integrated circuit package having pin up interconnect | Zalina Binti Abdullah, Roslan Bin Ahmad, Poh Cheng Ang, Poh Choon Whong, Shin Hung Hwang +2 more | 2018-08-14 |
| 9609759 | Method and system for depositing an object onto a wiring board | — | 2017-03-28 |