Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315995 | Grounding assembly for a semiconductor device | Mustafa Acar, Philipp Franz Freidl, Antonius Hendrikus Jozef Kamphuis, Jan Willem Bergman | 2025-05-27 |
| 12212074 | Single die design for different polarizations | Jan Willem Bergman, Mustafa Acar, Antonius Hendrikus Jozef Kamphuis, Dominicus Martinus Wilhelmus Leenaerts, Paul Mattheijssen | 2025-01-28 |
| 12199333 | Semiconductor device having uniform multi-package antenna array and method of manufacture | Antonius Hendrikus Jozef Kamphuis, Jan Willem Bergman, Marcellinus Johannes Maria Geurts, Mustafa Acar, Paul Mattheijssen +2 more | 2025-01-14 |
| 9859247 | Method for bonding bare chip dies | Edsger Constant Pieter Smits, Sandeep Menon Perinchery, Jeroen Van Den Brand, Harmannus Franciscus Maria Schoo | 2018-01-02 |
| 9752904 | Arrangement for providing information on fluid flow rate | Marcel Zevenbergen, Chuan Nie, Arnoldus Joannes Hubertus Frijns, Jacob Marinus Jan Den Toonder | 2017-09-05 |