Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10349525 | Substrate comprising an electrical circuit pattern, method and system for providing same | Rob Jacob Hendriks, Edsger Constant Pieter Smits, Pim Groen | 2019-07-09 |
| 9859247 | Method for bonding bare chip dies | Edsger Constant Pieter Smits, Jeroen Van Den Brand, Rajesh Mandamparambil, Harmannus Franciscus Maria Schoo | 2018-01-02 |