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High density low power interconnect using 3D die stacking |
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High density low power interconnect using 3D die stacking |
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2022-01-25 |
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Dendritic polypeptide-based nanocarriers for the delivery of therapeutic agents |
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2018-04-17 |
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Memory optimization in VLSI design using generic memory models |
Hai Phuong |
2017-12-26 |
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Generating specific memory models using generic memory models for designing memories in VLSI design |
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2017-08-08 |
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Designing memories in VLSI design using specific memory models generated from generic memory models |
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2017-08-08 |
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Scaling of integrated circuit design including logic and memory components |
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2016-10-04 |
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Scaling of integrated circuit design including high-level logic components |
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2016-10-04 |
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Scaling logic components of integrated circuit design |
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2016-10-04 |
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Integrated circuit design scaling for recommending design point |
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2016-10-04 |
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Scaling memory components of integrated circuit design |
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Integrated circuit design optimization |
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2016-09-27 |
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Cyclodextrin-modified polyamines for delivery of therapeutic molecules |
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