Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11004779 | Semiconductor device package and a method of manufacturing the same | Cheng-Lin Ho, Chih-Cheng Lee | 2021-05-11 |
| 10748843 | Semiconductor substrate including embedded component and method of manufacturing the same | Li-Chuan Tsai, Cheng-Lin Ho, Chih-Cheng Lee | 2020-08-18 |
| 10334728 | Reduced-dimension via-land structure and method of making the same | Cheng-Lin Ho, Chih-Cheng Lee | 2019-06-25 |