Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10553475 | Single layer integrated circuit package | Zalina Binti Abdullah, Roslan Bin Ahmad, Poh Choon Whong, Hai San Tew, Shin Hung Hwang +2 more | 2020-02-04 |
| 10461004 | Integrated circuit substrate and method of producing thereof | Zalina Binti Abdullah, Roslan Bin Ahmad, Poh Choon Whong, Hai San Tew, Shin Hung Hwang +2 more | 2019-10-29 |
| 10424492 | Method of fabricating integrated circuit packaging with etched base | Loke Chew Low, Linhui Yuan | 2019-09-24 |
| 10190218 | Integrated circuit substrate containing photoimageable dielectric material and method of producing thereof | Loke Chew Low, Linhui Yuan | 2019-01-29 |
| 10049935 | Integrated circuit package having pin up interconnect | Zalina Binti Abdullah, Roslan Bin Ahmad, Poh Choon Whong, Hai San Tew, Shin Hung Hwang +2 more | 2018-08-14 |