PS

Philip A. Saunders

IBM: 4 patents #21,733 of 70,183Top 35%
Overall (All Time): #1,237,131 of 4,157,543Top 30%
4
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
7897480 Preparation of high quality strained-semiconductor directly-on-insulator substrates Jack O. Chu, Alexander Reznicek, Leathen Shi 2011-03-01
7704815 Method of creating defect free high Ge content (>25%) SiGe-on-insulator (SGOI) substrates using wafer bonding techniques Jack O. Chu, Michael A. Cobb, Leathen Shi 2010-04-27
7445977 Method of creating defect free high Ge content (> 25%) SiGe-on-insulator (SGOI) substrates using wafer bonding techniques Jack O. Chu, Michael A. Cobb, Leathen Shi 2008-11-04
7235812 Method of creating defect free high Ge content (>25%) SiGe-on-insulator (SGOI) substrates using wafer bonding techniques Jack O. Chu, Michael A. Cobb, Leathen Shi 2007-06-26