Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11770899 | Electronic board having components in cavities and shared solder pads and manufacturing method for the same | Denis Lecordier | 2023-09-26 |
| 11284519 | Electronic board comprising SMDS soldered on buried solder pads | Denis Lecordier | 2022-03-22 |
| 10959338 | Attaching an SMD to an insulating layer with a solder joint in a cavity formed in an insulating layer | Denis Lecordier, Jacky Jouan | 2021-03-23 |
| 10952314 | Removal of high stress zones in electronic assemblies | Denis Lecordier | 2021-03-16 |