Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8697457 | Devices and methods for stacking individually tested devices to form multi-chip electronic modules | Keith K. Sturcken, John A. Hughes, Thomas E. Love, Sheila J. Konecke, Jeffrey Montag | 2014-04-15 |
| 8116090 | Low temperature co-fired ceramic (LTCC) transmit/receive (T/R) assembly utilizing ball grid array (BGA) technology | Blair E. Coburn, Candice L. Brittain, Thomas O Perkins, III, Michael Ehlert, Ronald H. Schmidt | 2012-02-14 |