Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11750983 | Microphone assembly with standoffs for die bonding | Tony K. Lim | 2023-09-05 |
| 11696082 | Insert molded or over molded insulating layers on enclosures for microphone assemblies | Lili Borna, Tony K. Lim | 2023-07-04 |
| 11662236 | Sensor package with ingress protection | Tony K. Lim | 2023-05-30 |
| 11259133 | Single line axis solder dispense process for a MEMS device | Anthony Schmitz | 2022-02-22 |
| 10640371 | Microelectromechanical system (MEMS) device packaging | Tony K. Lim | 2020-05-05 |
| 10591326 | Sensor package with ingress protection | Tony K. Lim | 2020-03-17 |
| 10291973 | Sensor device with ingress protection | Tony K. Lim | 2019-05-14 |
| 10227232 | Microelectromechanical system (MEMS) device packaging | Tony K. Lim | 2019-03-12 |