Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6721187 | Multi-layered high density connections | Richard R. Hall, How T. Lin, Christopher J. Majka, Matthew F. Seward, Ronald V. Smith | 2004-04-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6721187 | Multi-layered high density connections | Richard R. Hall, How T. Lin, Christopher J. Majka, Matthew F. Seward, Ronald V. Smith | 2004-04-13 |