Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10076024 | Differential interconnect with first and second transmission traces having a bend and including stub traces connected to the transmission traces | Ruihua Ding, Mo Liu | 2018-09-11 |
| 9936570 | Interconnect topology with staggered vias for interconnecting differential signal traces on different layers of a substrate | Russell N. Shryock | 2018-04-03 |
| 9386690 | First and second differential interconnects having interleaved stub traces | Ruihua Ding, Mo Liu | 2016-07-05 |
| 7229502 | Method of forming a silicon nitride layer | Ching-Tang Wang, Chin-Tung Niao, Keng-Hui Su, Huang-Sheng Chiu | 2007-06-12 |