Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9936570 | Interconnect topology with staggered vias for interconnecting differential signal traces on different layers of a substrate | Min Wang | 2018-04-03 |
| 6861921 | Removing ground plane resonance | Keith Dow | 2005-03-01 |
| 6665927 | Cutting a ground plane to remove circuit board resonance | Keith Dow | 2003-12-23 |