Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10076024 | Differential interconnect with first and second transmission traces having a bend and including stub traces connected to the transmission traces | Ruihua Ding, Mo Liu | 2018-09-11 | $19,778,000 |
| 9936570 | Interconnect topology with staggered vias for interconnecting differential signal traces on different layers of a substrate | Russell N. Shryock | 2018-04-03 | $16,515,000 |
| 9386690 | First and second differential interconnects having interleaved stub traces | Ruihua Ding, Mo Liu | 2016-07-05 | $9,080,000 |
| 7229502 | Method of forming a silicon nitride layer | Ching-Tang Wang, Chin-Tung Niao, Keng-Hui Su, Huang-Sheng Chiu | 2007-06-12 | $36,000 |