Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12061228 | Degradation monitor for bond wire to bond pad interfaces | Amar Ashok Mavinkurve | 2024-08-13 |
| 11508669 | Method and apparatus for improved circuit structure thermal reliability on printed circuit board materials | Leo van Gemert, Jeroen Johannes Maria Zaal, Romuald Olivier Nicolas Roucou | 2022-11-22 |
| 10825789 | Underbump metallization dimension variation with improved reliability | Leo van Gemert, Adrianus Buijsman, Jeroen Johannes Maria Zaal, Peter Joseph Hubert Drummen | 2020-11-03 |