Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11876031 | Thermal interface material paste and semiconductor package | Joungphil Lee, Wonkeun Kim | 2024-01-16 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11876031 | Thermal interface material paste and semiconductor package | Joungphil Lee, Wonkeun Kim | 2024-01-16 |