Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12418265 | Direct substrate to solder bump connection for thermal management in flip chip amplifiers | Bharatjeet Singh Gill, Stephen Joseph Kovacic | 2025-09-16 |
| 11515845 | Direct substrate to solder bump connection for thermal management in flip chip amplifiers | Bharatjeet Singh Gill, Stephen Joseph Kovacic | 2022-11-29 |
| 10869362 | WLAN front-end | Chun-Wen Paul Huang, Lui Lam, Mark M. Doherty | 2020-12-15 |
| 10790788 | Direct substrate to solder bump connection for thermal management in flip chip amplifiers | Bharatjeet Singh Gill, Stephen Joseph Kovacic | 2020-09-29 |
| 10522617 | Integrated RF front end system | Mark M. Doherty | 2019-12-31 |
| 10447210 | Flip chip amplifier for wireless device | Bharatjeet Singh Gill | 2019-10-15 |
| 10263072 | Integrated RF front end system | Mark M. Doherty | 2019-04-16 |
| 10211197 | Fabrication of radio-frequency devices with amplifier voltage limiting features | Anthony Francis Quaglietta | 2019-02-19 |
| 10193504 | Solder bump placement for thermal management in flip chip amplifiers | Bharatjeet Singh Gill | 2019-01-29 |
| 10181824 | Solder bump placement for grounding in flip chip amplifiers | Bharatjeet Singh Gill | 2019-01-15 |
| 10177716 | Solder bump placement for emitter-ballasting in flip chip amplifiers | Bharatjeet Singh Gill | 2019-01-08 |
| 10149347 | Front-end integrated circuit for WLAN applications | Chun-Wen Paul Huang, Lui Lam, Mark M. Doherty | 2018-12-04 |
| 10103254 | Semiconductor die fabrication methods | — | 2018-10-16 |
| 10069466 | Direct substrate to solder bump connection for thermal management in flip chip amplifiers | Bharatjeet Singh Gill, Stephen Joseph Kovacic | 2018-09-04 |
| 9818821 | Integrated RF front end system | Mark M. Doherty | 2017-11-14 |
| 9768157 | Amplifier voltage limiting in radio-frequency devices | Anthony Francis Quaglietta | 2017-09-19 |
| 9761700 | Bipolar transistor on high-resistivity substrate | — | 2017-09-12 |
| 9419073 | Integrated RF front end system | Mark M. Doherty | 2016-08-16 |
| 9373613 | Amplifier voltage limiting using punch-through effect | Anthony Francis Quaglietta | 2016-06-21 |
| 9048284 | Integrated RF front end system | Mark M. Doherty | 2015-06-02 |
| 8749032 | Integrated circuit with improved transmission line structure and electromagnetic shielding between radio frequency circuit paths | Mark M. Doherty, Chun-Wen Paul Huang | 2014-06-10 |
| 8729949 | Switching circuit | John Jackson Nisbet, Chun-Wen Paul Huang | 2014-05-20 |
| 8451044 | Switching circuit | John Jackson Nisbet, Chun-Wen Paul Huang | 2013-05-28 |
| 6917243 | Integrated power amplifier circuit | Mark M. Doherty, John D. Gillis, David R. Helms, Phillip Antognetti | 2005-07-12 |
| 6882220 | Integrated power amplifier circuit | Mark M. Doherty, John D. Gillis, David R. Helms, Phillip Antognetti | 2005-04-19 |