Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12418265 | Direct substrate to solder bump connection for thermal management in flip chip amplifiers | Michael Joseph McPartlin, Stephen Joseph Kovacic | 2025-09-16 |
| 11652079 | Backside metalization with through-wafer-via processing to allow use of high Q bond wire inductances | Grant Darcy Poulin | 2023-05-16 |
| 11621676 | Auto-linearizing amplifier | Mackenzie Brian Cook | 2023-04-04 |
| 11515845 | Direct substrate to solder bump connection for thermal management in flip chip amplifiers | Michael Joseph McPartlin, Stephen Joseph Kovacic | 2022-11-29 |
| 11171110 | Backside metalization with through-wafer-via processing to allow use of high q bondwire inductances | Grant Darcy Poulin | 2021-11-09 |
| 10790788 | Direct substrate to solder bump connection for thermal management in flip chip amplifiers | Michael Joseph McPartlin, Stephen Joseph Kovacic | 2020-09-29 |
| 10447210 | Flip chip amplifier for wireless device | Michael Joseph McPartlin | 2019-10-15 |
| 10193504 | Solder bump placement for thermal management in flip chip amplifiers | Michael Joseph McPartlin | 2019-01-29 |
| 10181824 | Solder bump placement for grounding in flip chip amplifiers | Michael Joseph McPartlin | 2019-01-15 |
| 10177716 | Solder bump placement for emitter-ballasting in flip chip amplifiers | Michael Joseph McPartlin | 2019-01-08 |
| 10069466 | Direct substrate to solder bump connection for thermal management in flip chip amplifiers | Michael Joseph McPartlin, Stephen Joseph Kovacic | 2018-09-04 |
| 9407215 | Circuits and methods related to low-noise amplifiers having improved linearity | — | 2016-08-02 |