Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8841774 | Semiconductor device including a first wiring having a bending portion a via | Hiroyuki Uehara, Hidetoshi Nishimura | 2014-09-23 |
| 8426978 | Semiconductor device including a first wiring having a bending portion and a via including the bending portion | Hiroyuki Uehara, Hidetoshi Nishimura | 2013-04-23 |
| 7503026 | Cell, standard cell, standard cell library, a placement method using standard cell, and a semiconductor integrated circuit | Toshiyuki Moriwaki, Tetsurou Toubou | 2009-03-10 |