Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7811492 | Process and apparatus for trimming polymeric parts | Gary D. Ennis, David John Claudius, Lee Alexander | 2010-10-12 |
| 7291924 | Flip chip stacked package | Sung-Fei Wang | 2007-11-06 |
| 7220619 | Process of cutting electronic package | Ming-Chieh Kao | 2007-05-22 |
| 7098071 | Method for flip chip bonding by utilizing an interposer with embedded bumps | Chih-Ming Chung | 2006-08-29 |
| 7019407 | Flip chip package structure | Yu-Wen Chen, Shih-Chang Lee, Chih-Huang Chang | 2006-03-28 |
| 7002246 | Chip package structure with dual heat sinks | Yu-Wen Chen | 2006-02-21 |