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Dampener for an exit device |
Vincent Baker, Michael Swearman, Douglas Thompson |
2024-02-20 |
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Retrofit latch adapter |
Vincent Baker, Douglas Thompson, Catelyn Herman |
2022-01-04 |
| D936446 |
Exit device |
Luis Bettencourt, Doug Thompson |
2021-11-23 |
| D922173 |
Door handle |
Douglas Thompson, Luke E. Clay |
2021-06-15 |
| D906082 |
Combined exit device and door |
Luis Bettencourt, Doug Thompson |
2020-12-29 |
| 10704298 |
Panic exit device and door handle |
Doug Thompson, Luis Bettencourt |
2020-07-07 |
| 7727785 |
Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive |
Tongbi Jiang |
2010-06-01 |
| 7557337 |
Micro-lens configuration for small lens focusing in digital imaging devices |
Tongbi Jiang, Jin Li |
2009-07-07 |
| 7405385 |
Micro-lens configuration for small lens focusing in digital imaging devices |
Tongbi Jiang, Jin Li |
2008-07-29 |
| 7297412 |
Fabrication of stacked microelectronic devices |
Tongbi Jiang |
2007-11-20 |
| 7169685 |
Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive |
Tongbi Jiang |
2007-01-30 |
| 7115853 |
Micro-lens configuration for small lens focusing in digital imaging devices |
Tongbi Jiang, Jin Li |
2006-10-03 |
| 7037751 |
Fabrication of stacked microelectronic devices |
Tongbi Jiang |
2006-05-02 |
| 7037756 |
Stacked microelectronic devices and methods of fabricating same |
Tongbi Jiang |
2006-05-02 |
| 7022418 |
Fabrication of stacked microelectronic devices |
Tongbi Jiang |
2006-04-04 |
| 7001795 |
Total internal reflection (TIR) CMOS imager |
Tongbi Jiang, Jin Li |
2006-02-21 |
| 6995442 |
Total internal reflection (TIR) CMOS imager |
Tongbi Jiang, Jin Li |
2006-02-07 |
| 6896760 |
Fabrication of stacked microelectronic devices |
Tongbi Jiang |
2005-05-24 |
| 6894380 |
Packaged stacked semiconductor die and method of preparing same |
Tongbi Jiang |
2005-05-17 |
| 6882036 |
Apparatuses for forming thin microelectronic dies |
Nathan R. Draney |
2005-04-19 |
| 6762074 |
Method and apparatus for forming thin microelectronic dies |
Nathan R. Draney |
2004-07-13 |
| 6514795 |
Packaged stacked semiconductor die and method of preparing same |
Tongbi Jiang |
2003-02-04 |
| 6198861 |
Method of using thin-clad near infrared transparent optical glass fibers as evanescent wave sensors |
Jon Kellar, William M. Cross, Jr., Farrah J. Johnson |
2001-03-06 |
