Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424489 | Semiconductor device including multi-capping layer and method for manufacturing the same | Jongmin Lee, Jimin Choi | 2025-09-23 |
| 12347747 | Semiconductor devices including a through-hole electrode | Jimin Choi, Jongmin Lee, Yeonjin Lee, Jeonil Lee, Juik Lee | 2025-07-01 |
| 12230587 | Semiconductor device with crack-preventing structure | Yeonjin Lee, Jeonil Lee, Jongmin Lee | 2025-02-18 |
| 12080663 | Semiconductor devices including a thick metal layer and a bump | Sooho Shin, Yeonjin Lee, Junghoon Han | 2024-09-03 |
| 12072374 | Detection pad structure for analysis in a semiconductor device | Jihoon Chang, Yeonjin Lee, Jimin Choi | 2024-08-27 |
| 11817408 | Semiconductor devices including a thick metal layer and a bump | Sooho Shin, Yeonjin Lee, Junghoon Han | 2023-11-14 |
| 11776894 | Semiconductor chip including low-k dielectric layer | Yeonjin Lee, Junyong Noh, Junghoon Han, Yunrae Cho | 2023-10-03 |
| 11756843 | Semiconductor devices including scribe lane and method of manufacturing the semiconductor devices | Junyong Noh, Yeonjin Lee, Junghoon Han | 2023-09-12 |
| 11670559 | Semiconductor device | Jung-Hoon Han, Jiho Kim, Young-Yong Byun, Yeonjin Lee, Jihoon Chang | 2023-06-06 |
| 11557556 | Semiconductor devices including a thick metal layer and a bump | Sooho Shin, Yeonjin Lee, Junghoon Han | 2023-01-17 |
| 11342235 | Semiconductor devices including scribe lane and method of manufacturing the semiconductor devices | Junyong Noh, Yeonjin Lee, Junghoon Han | 2022-05-24 |
| 11049827 | Semiconductor devices including a thick metal layer and a bump | Sooho Shin, Yeonjin Lee, Junghoon Han | 2021-06-29 |