YL

Yeonjin Lee

Samsung: 18 patents #7,482 of 75,807Top 10%
Overall (All Time): #243,491 of 4,157,543Top 6%
18
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12347747 Semiconductor devices including a through-hole electrode Jimin Choi, Jongmin Lee, Jeonil Lee, Juik Lee, Minjung Choi 2025-07-01
12288734 Semiconductor device Juik Lee, Jong Min Lee, Jimin Choi, Jeon Il Lee 2025-04-29
12230587 Semiconductor device with crack-preventing structure Minjung Choi, Jeonil Lee, Jongmin Lee 2025-02-18
12199015 Semiconductor device including via structure and method for manufacturing the same Jongmin Lee, Jeonil Lee 2025-01-14
12183660 Semiconductor device including through-silicon via and method of forming the same Jeonil Lee, Jongmin Lee, Jimin Choi 2024-12-31
12080663 Semiconductor devices including a thick metal layer and a bump Minjung Choi, Sooho Shin, Junghoon Han 2024-09-03
12072374 Detection pad structure for analysis in a semiconductor device Jihoon Chang, Minjung Choi, Jimin Choi 2024-08-27
11948882 Semiconductor device and method of fabricating the same Jihoon Chang, Jimin Choi, Hyeon-Woo Jang, Jung-Hoon Han 2024-04-02
11817408 Semiconductor devices including a thick metal layer and a bump Minjung Choi, Sooho Shin, Junghoon Han 2023-11-14
11776894 Semiconductor chip including low-k dielectric layer Junyong Noh, Minjung Choi, Junghoon Han, Yunrae Cho 2023-10-03
11756843 Semiconductor devices including scribe lane and method of manufacturing the semiconductor devices Minjung Choi, Junyong Noh, Junghoon Han 2023-09-12
11670559 Semiconductor device Minjung Choi, Jung-Hoon Han, Jiho Kim, Young-Yong Byun, Jihoon Chang 2023-06-06
11587897 Semiconductor device Joongwon Shin, Inyoung Lee, Jimin Choi, Jung-Hoon Han 2023-02-21
11557556 Semiconductor devices including a thick metal layer and a bump Minjung Choi, Sooho Shin, Junghoon Han 2023-01-17
11495533 Semiconductor device and method of fabricating the same Jihoon Chang, Jimin Choi, Hyeon-Woo Jang, Jung-Hoon Han 2022-11-08
11476220 Semiconductor packages Jimin Choi, Jung-Hoon Han, Jong Min Lee, Jihoon Chang 2022-10-18
11342235 Semiconductor devices including scribe lane and method of manufacturing the semiconductor devices Minjung Choi, Junyong Noh, Junghoon Han 2022-05-24
11049827 Semiconductor devices including a thick metal layer and a bump Minjung Choi, Sooho Shin, Junghoon Han 2021-06-29