Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842976 | Semiconductor package structure with heat sink and method preparing the same | Hanlung Tsai, Chengchung Lin | 2023-12-12 |
| 11488925 | Semiconductor package structure with heat sink and method preparing the same | Hanlung Tsai, Chengchung Lin | 2022-11-01 |